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SEALANTS  AND UNDERLAYMENT

 

Please click on the  links below (or scroll down) to view information.

 
                  Joint Sealant   (STD)
                  Backer Rod   (STD)
                  Butyl Sealant   (Metflush / Metflush II)
                  Underlayment
   
 

Joint Sealant    (STD)

Use Dow Corning ® 795  or Tremco Spectrum 1 ® for panel-to-panel joints. For joints with other substrates please refer to Dow Corning’s or Tremco specifications.

For more information on the following approved products, click on the links below.

 

 

Backer Rod   (STD)

Use ITP soft type manufactured by Industrial Thermo Polymers LTD. or Sof ® Rod manufactured by Applied Extrusion Technologies Inc.

For more information on the following approved products, click on the links below.

Butyl Sealant   (Metflush / Metflush II)

Use PTI ® 707 Architectural Butyl Sealant

For more information on the following approved products, click on the links below.

Underlayment

Metposite panels can be installed over most commercial vapor barriers.

For more information on the following approved products, click on the links below.

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